Hot Plate

Hot Plate

HP-155 - Compact hot plate with integrated precision controller

Compact hot plate with integrated precision controller Reflow of any soldering alloy Pre-heating for wire bonding Expoy curing Laboratory tests

Technical Data:

Heated Area: 155x155 mm
Temperature Range: up to 350 °C
Power supply:

230V, 1000 Watts
or
115V, 1000 Watts

Dimension HP-155: 320 mm x 210 mm x 55 mm
Weight> 3,5kg

HP-220 - Programmable hot plate with integrated high precision Eurotherm controllerand vacuum hold

Programmable hot plate with integrated high precision Eurotherm controllerand vacuum hold for 2 pc 100mm wafer/substrrate size

Applications examples:Reflow Soldering of flat componentsPreheating of heavy parts for solderingAnnealingCuring of photoresists and epoxies Laboratory tests

Optional: Cover with viewing window and connection to exhaust for solvents

accepts 2 pieces 100mm wafers parallel
heated area: 220 mm x 155 mm
Part fixture: 2 vacuum holes in the heated plate
Temperature Range: up to 250 °C
Ramp-up rate: max. 25 K/min
Ramp-down rate: max. 10 K/min
Cool down: controlled cool down
Programming: programmable with up to 16 segments (heating and cooling)
Interface to PC: USB interface and PC-Windows Software (as option) for programming, program administration and monitoring
Cover: with cover protection for connection to exhaust (solvent vapors) (height under cover: 80mm)
Leveling feet: adjustable

 

HP-300 - Heated chuck for 300 mm x 300 mm substrates or 300 mm Diameter

This high precision hot chuck has a heated area with  310 x 310 mm.
It can be used as build-in or stand-alone chuck with an external controller.

The vacuum hot plate has vacuum holes in a pitch of 25mm each (1mm Diameter)
for holding the substrate or wafer.

The maximum temperature is 300 °C.

3-Zone-temperature measurement

incl. Software for managing the temperature profiles

IP code 23

Die Vakuumplatte hat Rasterbohrungen im 25mm Abstand (1mm Bohrungen)
Die maximale Temperatur beträgt 300 °C.

3-Zonen-Temperaturmessung
inkl. Software zur Verwaltung von Temperaturprofilen
Gehäuseart: IP23

HP-60 - Reflow Soldering of flat components

Applications examples:

  • Reflow Soldering of flat components
  • Preheating of heavy parts for soldering,
  • annealing.
  • curing of photoresists and epoxies

Technical Data:

Heated Area: 60 mm diameter
Temperature Range: up to 250 °C
Power supply: 40V, 80Watts
Dimension: dia. 80mm total
Height adjustable: 66-78mm
Weight 0,6kg
External Temperature Controller: HC-40

 

HP-155 - Programmable Hot Plate with vacuum hold

Programmable Hot Plate with vacuum hold for 3" up to 6" wafer size wafer size or 150x150mm substrate size

  • Applications examples:
  • Reflow Soldering of flat components
  • Preheating of heavy parts for soldering
  • Annealing
  • Curing of photoresists and epoxies

Options:
USB interface including UniSoft Software

Technical Data:

Heated Area: 155x155 mm
Controller: Eurotherm 2416 model
Temperature Range: up to 350 °C
Power supply: 230V, 1000 Watts
or
115V, 1000Watts
Dimension HPP-155: 320x210x85mm
Weight 4 kg

 

HPP-155-L - Programmable Hot Plate with lift pins

Programmable Hot Plate with lift pins with vacuum hold for 3" up to 6" wafer size wafer size or 150 x 150 mm substrate size

  • Applications examples:
  • Reflow Soldering of flat components
  • Preheating of heavy parts for soldering
  • Annealing
  • Curing of photoresists and epoxies

Technical Data:

Heated area: 155 x 155 mm
Lift pins: 3 lift pins programmable
Temperature range: Room temperature up to 350 °C
Part fixture: by vacuum for external vacuum pump
Programming: USB (optional) with Eurotherm 2416 controller
Power supply: 230 V, 1000 W or 115 V, 1000 W
Weight: 4 kg

 

Plasma Cleaning & Heat: PTP-300 - Universal temperature and plasma cleaning machine with maximum part loading area

Universal temperature and plasma cleaning machine with maximum part loading area: 305 mm x 305 mm (25 mm max. part height)

Applications:

  • Activation, cleaning and coating of surfaces
  • fast ramp up heating of substrates and wafers
  • fluxless soldering
  • flip chip processing
  • adhesive bonding
  • Solder bump reflow
  • Soldering of power devices
  • small series production and prototype development

Technical Data PTP-300 :

Loading area: 305 mm x 305 mm x 25 mm (process area)
Chamber height: 35 mm
Chamber material: Aluminium / quartz glass
Chamber material (optional): Aluminium or quartz glass process chamber (size: 305 x 305 x 26 mm)
Dimension outside: 600 mm x 1850 x 880 mm (WxDxH)
Chamber: integrated gas inlet / 2 gas lines are default
Gas lines: 2 Mass Flow Controllers
Vacuum: DN25 KF vacuum flange
Heating: 24 infrared lamps (total 18 kW)
Process control by: SPS Controller PP420 (B&R) with LCD display
Maintenance: Ethernet
Microwave generator: for plasma cleaning or removal of oxyde resists 2,45 GHz, max. 600 W, stepless from 100 W to 600 W
Cooling: water cooling required (water cooler optional)
Power: 3/N/PE; AC; 50/60 Hz; 230/400 V
Weight: 150-200 kg (depends on acessories)


Options and accessories:

PTP-AL Automatic Loading
PTP-MFC Mass Flow Controller
PTP-RPP Double stage rotary vane pump for vacuum up to 10-3 mbar
PTP-HVP Turbomolecular pump with gate valve and Pirani gauge for vacuum up to 10-6 mbar
PTP-WC Closed loop water cooling system