Rapid Thermal Processing (RTP)/Rapid Thermal Annealing (RTA)

Rapid Thermal Processing (RTP)/Rapid Thermal Annealing (RTA)

RTP-100, front loading

Rapid Thermal Vacuum Process Oven with ramp-up rate up to 150 K/sec.

Technical Data:

  • good temperature uniformity
  • precisely controlled ramp-up rates and fast ramp-down rates
  • low process turnaround
  • comfortable gas control
  • table top system with small foot print

Multipurpose table top unit with front loading drawer for the following applications:

  • excellent tool for various semiconductor processes
  • implementing of new semiconductor processes
  • prototype research
  • quality control
  • annealing
  • Rapid Thermal Processes
  • SiAu, SiAl, SiMo alloying
  • low k dielectrics
  • post implanting annealing
  • copper paste firing
  • resistor paste firing
  • other processes on demand


Technical Data:

  • for single wafer up to 100 mm (4") or 100 mm x 100 mm substrate size
  • process chamber made of quartz glass
  • with integrated gas in- and outlet
  • incl. one process gas line with Mass Flow Controller for Nitrogen (5 nlm = norm liter per min.)
  • heated by 18 infrared lamps (20 kW)
  • top and bottom heating (can be choosen)
  • vacuum capable for external pump system (up to 10E-3 hPa, for up to 10E-6 hPa: see RTP-100-HV)
  • SPS process controller with 50 programs and up to 50 steps each (ethernet interface), SIMATIC
  • 7" touch panel for easy programming and process control
  • max. temperature 1200 °C    
  • temperature control by thermocouple
  • water cooling required
  • electrical connection type: 32 A CEE plug (3x 230 V, 3 Phase, N, PE, 20 kW)
  • dimension oven: 504 x 504 (700) x 570  mm (w x d x h)
  • weight: 55 kg

The oven will be programmed by a Siemens SPS controller. This allows the storage of 50 programs with saving all temperature profiles and segments.
Options and accessories like water cooler, additional flow meters, additional gas lines, additional thermocouple etc. are available on request. This tool
is for various applications and customers. The small size allows comfortable loading and unloading of the chamber. The oven can be easily placed on
a standard laboratory table.

Options and accessories:

RTP-100 Basic unit with 1 MFC for Nitrogen (5 nlm)
RTP-MFC Mass Flow controller (max. 4 in total)
VAC I Vacuum up to 3 hPa incl. Vacuum sensor and valve (excl. Pump)
VAC II Vacuum up to 10E-3 hPa incl. Vacuum sensor and valve (excl. Pump)
MP Membrane or diapgrahm pump
RVP Rotary vane pump
RTP-Ox Oxygen measurement
RTP-MM Moisture measurement
RTP-H2+H2S Hydrogen Module to use 100% Hydrogen with safety device incl. MFC
RTP-SW Switchbox for chiller and/or vacuum pump
RTP-TC Add. Thermocouple to measure on device (max. 1 pc)
RTP-VCR VCR connectors and lines (on request)
WC III Closed loop water cooling station
RTP-GP Graphite Plate or suzceptor (SiC coated: on request)
RTP-PC-100 additional oven chamber for usage with one process controller unit (double pack oven) 100 mm
RTP-QR-50 Adapter for 50 mm wafer
RTP-QR-75 Adapter for 75 mm wafer

 

RTP-100-EP front loading with 200K/sec ramp up rate

Vacuum compliant Rapid Thermal Process Oven with ramp-up rate up to 200 K/sec.

Key features are

  • good temperature uniformity
  • precisely controlled ramp-up rates and fast ramp-down rates
  • low process turnaround
  • comfortable gas control
  • table top system with small foot print

Multipurpose table top unit with front loading drawer for the following applications:

  • excellent tool for various semiconductor processes
  • implementing of new semiconductor processes
  • prototype research
  • quality control
  • annealing
  • Rapid Thermal Processes
  • SiAu, SiAl, SiMo alloying
  • low k dielectrics
  • post implanting annealing
  • copper paste firing
  • resistor paste firing
  • other processes on demand


Technical Data:

  • for single wafer up to 100 mm (4")
  • process chamber made of quartz glass
  • with integrated gas in- and outlet
  • incl. one process gas line with Mass Flow Controller for Nitrogen (5 nlm = norm liter per min.)
  • heated by top and bottom IR heating  each with 9 lamps and 14 kW
  • top and bottom heating
  • vacuum capable for external pump system for up to 10E-3 hPa
  • SPS process controller with 50 programs and up to 50 steps each (ethernet interface), SIMATIC
  • 7" touch panel for easy programming and process control
  • max. temperature 1200 °C
  • temperature control by thermocouple
  • water cooling required
  • electrical connection type: 2 x 32 A CEE plug (3x 230 V, 3 Phase, N, PE, 18 kW)
  • dimension oven: 504 x 521 x 576 mm (w x d x h)
  • weight: 60 kg

The oven will be programmed by a Siemens SPS controller. This allows the storage of 50 programs with saving all temperature profiles and segments. Options and accessories like water cooler, additional flow meters, additional gas lines, additional thermocouple etc. are available on request. This tool is for various applications and customers. The small size allows comfortable loading and unloading of the chamber. The oven can be easily placed on a standard laboratory table.

 

Options and accessories:

RTP-100-EP                                                                                                          Basic unit with 1 MFC for Nitrogen (5 nlm)               
RTP-MFC Mass Flow controller (max. 4 in total)
MP Membrane or diapgrahm pump
RVP Rotary vane pump
RTP-Ox Oxygen level measurement
RTP-MM Moisture level measurement 
RTP-H2+H2S      Hydrogen Module to use 100% Hydrogen with safety device incl.  MFC    
RTP-SW Switchbox for chiller and/or vacuum pump
RTP-TC  Add. Thermocouple to measure on device (max. 1 pc)
RTP-VCR VCR connectors and lines (on request)
WC III Closed loop water cooling station
RTP-GP Graphite Plate or suzceptor (SiC coated: on request)     
RTP-100-PC     additional oven chamber for usage with one process controller unit (double pack oven) 100 mm
RTP-QR-50 Adapter for 50 mm wafer size
RTP-QR-75 Adapter for 75 mm wafer size



 

RTP-100-HV (High Vacuum) front loading

High vacuum compliant Rapid Thermal Process Oven with ramp-up rate up to 150 K/sec.

Key features are

  • good temperature uniformity
  • precisely controlled ramp-up rates and fast ramp-down rates
  • low process turnaround
  • comfortable gas control
  • table top system with small foot print

Multipurpose table top unit with front loading drawer for the following applications:

  • excellent tool for various semiconductor processes
  • implementing of new semiconductor processes
  • prototype research
  • quality control
  • annealing
  • Rapid Thermal Processes
  • SiAu, SiAl, SiMo alloying
  • low k dielectrics
  • post implanting annealing
  • copper paste firing
  • resistor paste firing
  • other processes on demand


Technical Data:

  • for single wafer up to 100 mm (4")
  • process chamber made of quartz glass
  • with integrated gas in- and outlet
  • incl. one process gas line with Mass Flow Controller for Nitrogen (5 nlm = norm liter per min.)
  • heated by 18 infrared lamps (20 kW)
  • top and bottom heating
  • vacuum capable for external pump system (up to 10E-6 hPa, for up to 10E-3 hPa: see RTP-100),
    incl. turbo molecular pump, vacuum measurement, gate valve and pressure gauge; excl. rough pump
  • SPS process controller with 50 programs and up to 50 steps each (ethernet interface), SIMATIC
  • 7" touch panel for easy programming and process control
  • max. temperature 1200 °C
  • temperature control by thermocouple
  • water cooling required
  • electrical connection type: 32 A CEE plug (3x 230 V, 3 Phase, N, PE, 18 kW)
  • dimension oven: 504 x 521 x 576 mm (w x d x h)
  • weight: 68 kg

The oven will be programmed by a Siemens SPS controller. This allows the storage of 50 programs with saving all temperature profiles and segments. Options and accessories like water cooler, additional flow meters, additional gas lines, additional thermocouple etc. are available on request. This tool is for various applications and customers. The small size allows comfortable loading and unloading of the chamber. The oven can be easily placed on a standard laboratory table.

 

Options and accessories:

RTP-100-HV                                                                                                          Basic unit with 1 MFC for Nitrogen (5 nlm)               
RTP-MFC Mass Flow controller (max. 4 in total)
MP Membrane or diapgrahm pump
RVP Rotary vane pump
RTP-Ox Oxygen level measurement
RTP-MM Moisture level measurement 
RTP-H2+H2S      Hydrogen Module to use 100% Hydrogen with safety device incl.  MFC    
RTP-SW Switchbox for chiller and/or vacuum pump
RTP-TC  Add. Thermocouple to measure on device (max. 1 pc)
RTP-VCR VCR connectors and lines (on request)
WC III Closed loop water cooling station
RTP-GP Graphite Plate or suzceptor (SiC coated: on request)     
RTP-100-PC     additional oven chamber for usage with one process controller unit (double pack oven) 100 mm
RTP-QR-50 Adapter for 50 mm wafer size
RTP-QR-75 Adapter for 75 mm wafer size



 

RTP-100-HV-EP (High Vacuum) front loading with 200K/sec ramp up rate

High vacuum compliant Rapid Thermal Process Oven with ramp-up rate up to 200 K/sec.

Key features are

  • good temperature uniformity
  • precisely controlled ramp-up rates and fast ramp-down rates
  • low process turnaround
  • comfortable gas control
  • table top system with small foot print

Multipurpose table top unit with front loading drawer for the following applications:

  • excellent tool for various semiconductor processes
  • implementing of new semiconductor processes
  • prototype research
  • quality control
  • annealing
  • Rapid Thermal Processes
  • SiAu, SiAl, SiMo alloying
  • low k dielectrics
  • post implanting annealing
  • copper paste firing
  • resistor paste firing
  • other processes on demand


Technical Data:

  • for single wafer up to 100 mm (4")
  • process chamber made of quartz glass
  • with integrated gas in- and outlet
  • incl. one process gas line with Mass Flow Controller for Nitrogen (5 nlm = norm liter per min.)
  • heated by top and bottom IR heating  each with 9 lamps and 14 kW
  • top and bottom heating
  • vacuum capable for external pump system (up to 10E-6 hPa, for up to 10E-3 hPa: see RTP-100),
    incl. turbo molecular pump, vacuum measurement, gate valve and pressure gauge; excl. rough pump
  • SPS process controller with 50 programs and up to 50 steps each (ethernet interface), SIMATIC
  • 7" touch panel for easy programming and process control
  • max. temperature 1200 °C
  • temperature control by thermocouple
  • water cooling required
  • electrical connection type: 2 x 32 A CEE plug (3x 230 V, 3 Phase, N, PE, 18 kW)
  • dimension oven: 504 x 521 x 576 mm (w x d x h)
  • weight: 68 kg

The oven will be programmed by a Siemens SPS controller. This allows the storage of 50 programs with saving all temperature profiles and segments. Options and accessories like water cooler, additional flow meters, additional gas lines, additional thermocouple etc. are available on request. This tool is for various applications and customers. The small size allows comfortable loading and unloading of the chamber. The oven can be easily placed on a standard laboratory table.

 

Options and accessories:

RTP-100-HV-EP                                                                                                          Basic unit with 1 MFC for Nitrogen (5 nlm)               
RTP-MFC Mass Flow controller (max. 4 in total)
MP Membrane or diapgrahm pump
RVP Rotary vane pump
RTP-Ox Oxygen level measurement
RTP-MM Moisture level measurement 
RTP-H2+H2S      Hydrogen Module to use 100% Hydrogen with safety device incl.  MFC    
RTP-SW Switchbox for chiller and/or vacuum pump
RTP-TC  Add. Thermocouple to measure on device (max. 1 pc)
RTP-VCR VCR connectors and lines (on request)
WC III Closed loop water cooling station
RTP-GP Graphite Plate or suzceptor (SiC coated: on request)     
RTP-100-PC     additional oven chamber for usage with one process controller unit (double pack oven) 100 mm
RTP-QR-50 Adapter for 50 mm wafer size
RTP-QR-75 Adapter for 75 mm wafer size



 

RTP-150, front loading

Rapid Thermal Vacuum Process Oven with ramp up rate up to 75 K/sec.

Key features are

  • good temperature uniformity
  • precisely controlled ramp-up rates and fast ramp-down rates
  • low process turnaround
  • comfortable gas control
  • table top system with small foot print

Multipurpose table top unit with front loading drawer for the following applications:

  • excellent tool for various semiconductor processes
  • implementing of new semiconductor processes
  • prototype research
  • quality control
  • annealing
  • Rapid Thermal Processes
  • SiAu, SiAl, SiMo alloying
  • low k dielectrics
  • post implanting annealing
  • copper paste firing
  • resistor paste firing
  • other processes on demand

Technical Data:

  • for single wafer up to 150 mm (6") or 156 mm x 156 mm substrate size
  • (optional: adapter for 100 mm)
  • process chamber made of quartz glass (chamber height: 40 mm)
  • with integrated gas in- and outlet
  • incl. one process gas line with Mass Flow Controller for Nitrogen (5 nlm = norm liter per min.)
  • heated by 24 infrared lamps (21 kW)
  • top and bottom heating
  • ramp down rate: T=1000 °C˃400 °C 200 K/min.
    ramp down rate: T=  400 °C˃100 °C   30 K/min.
  • vacuum capable for external pump system (up to 10E-3 hPa, for up to 10E-6 hPa: see RTP-150-HV)
  • SPS process controller with 50 programs and up to 50 steps each (ethernet interface), SIMATIC
  • 7" touch panel for easy programming and process control
  • max. temperature 1000 °C
  • temperature control by thermocouple
  • water cooling required
  • electrical connection type: 32 A CEE plug (3 x 230 V, 3 Phase, N, PE, 21 kW)
  • dimension oven: 504 mm x 504 mm (700) x 570 mm (w x d x h)
  • weight: 55 kg

The oven will be programmed by a Siemens SPS controller. This allows the storage of 50 programs with saving all temperature profiles and segments.
Options and accessories like water cooler, additional flow meters, additional gas lines, additional thermocouple etc. are available on request. This tool
is for various applications and customers. The small size allows comfortable loading and unloading of the chamber. The oven can be easily placed on
a standard laboratory table.

 Options and accessories:

RTP-150 Basic unit with 1 MFC for Nitrogen (5 nlm = Normliter pro Minute)
RTP-MFC Mass Flow Controller (max. 4 in total)
RTP-GP Graphite plate or susceptor
MP Membrane (Diahragm) Pump up to 10 hPA with manometer
RVP Rotary vane pump system for vacuum up to 10exp.-3 hPa with oil filter and manometer
RTP-PC-150 additional oven chamber for parallel usage with one process controller unit (double pack oven) 150 mm;
no simultaneous operation of both chambers possible
RTP-QP Quartz plate
RTP-QC-150        spare quartz chamber for RTP-150
   
RTP-TC additional thermocouple to measure on device (plugged in chamber) (max. 3 pcs.)
RTP-VM Vacuum measurement with data logging, up to 10exp.-3 hPa
WC III Closed loop water cooling system

 

RTP-150-EP (NEW), front loading

Rapid Thermal Vacuum Process Oven with ramp up rate up to 150 K/sec.

Key features are

  • good temperature uniformity
  • precisely controlled ramp-up rates and fast ramp-down rates
  • low process turnaround
  • comfortable gas control
  • table top system with small foot print

Multipurpose table top unit with front loading drawer for the following applications:

  • excellent tool for various semiconductor processes
  • implementing of new semiconductor processes
  • prototype research
  • quality control
  • annealing
  • Rapid Thermal Processes
  • SiAu, SiAl, SiMo alloying
  • low k dielectrics
  • post implanting annealing
  • copper paste firing
  • resistor paste firing
  • other processes on demand

Technical Data:

  • for single wafer up to 150 mm (6") or 156 mm x 156 mm substrate size
  • (optional: adapter for 100 mm)
  • process chamber made of quartz glass (chamber height: 40 mm)
  • with integrated gas in- and outlet
  • incl. one process gas line with Mass Flow Controller for Nitrogen (5 nlm = norm liter per min.)
  • heated by 24 infrared lamps (42 kW)
  • top and bottom heating
  • ramp down rate: T=1000 °C˃400 °C 200 K/min.
    ramp down rate: T=  400 °C˃100 °C   30 K/min.
  • vacuum capable for external pump system (up to 10E-3 hPa, for up to 10E-6 hPa: see RTP-150-HV)
  • SPS process controller with 50 programs and up to 50 steps each (ethernet interface), SIMATIC
  • 7" touch panel for easy programming and process control
  • max. temperature 1000 °C
  • temperature control by thermocouple
  • water cooling required
  • electrical connection type: 2x[32 A CEE plug (3 x 230 V, 3 Phase, N, PE>
  • dimension oven: 504 mm x 504 mm (700) x 570 mm (w x d x h)
  • weight: 58 kg

The oven will be programmed by a Siemens SPS controller. This allows the storage of 50 programs with saving all temperature profiles and segments.
Options and accessories like water cooler, additional flow meters, additional gas lines, additional thermocouple etc. are available on request. This tool
is for various applications and customers. The small size allows comfortable loading and unloading of the chamber. The oven can be easily placed on
a standard laboratory table.

 Options and accessories:

RTP-150-EP Basic unit with 1 MFC for Nitrogen (5 nlm = Normliter pro Minute)
RTP-MFC Mass Flow Controller (max. 4 in total)
RTP-GP Graphite plate or susceptor
RTP-PC-150 additional oven chamber for parallel usage with one process controller unit (double pack oven) 150 mm;
no simultaneous operation of both chambers possible
RTP-QP Quartz plate
RTP-QC-150        spare quartz chamber for RTP-150
RTP-TC additional thermocouple to measure on device (plugged in chamber) (max. 3 pcs.)
WC III Closed loop water cooling system
Vacuum We offer suitable vacuum equipment also vacuum pumps als option (10 hPa up to  10-exp3hPa)
High vacuum: see RTP-150-HV)
 

 

RTP-150-HV (High Vacuum), front loading

High vacuum compliant Rapid Thermal Process Oven with ramp up rate up to 75 K/sec.

Key features are

  • good temperature uniformity
  • precisely controlled ramp-up rates and fast ramp-down rates
  • low process turnaround
  • comfortable gas control
  • table top system with small foot print

Multipurpose table top unit with front loading drawer for the following applications:

  • excellent tool for various semiconductor processes
  • implementing of new semiconductor processes
  • prototype research
  • quality control
  • annealing
  • Rapid Thermal Processes
  • SiAu, SiAl, SiMo alloying
  • low k dielectrics
  • post implanting annealing
  • copper paste firing
  • resistor paste firing
  • other processes on demand

Technical Data:

  • for single wafer up to 150 mm (6") or 156 mm x 156 mm substrate size
  • (optional: adapter for 100 mm)
  • process chamber made of quartz glass (chamber height: 40 mm)
  • with integrated gas in- and outlet
  • incl. one process gas line with Mass Flow Controller for Nitrogen (5 nlm = norm liter per min.)
  • heated by 24 infrared lamps (21 kW)
  • top and bottom heating
  • ramp down rate: T=1000 °C˃400 °C 200 K/min.
  • ramp down rate: T=   400 °C˃100 °C   30 K/min.
  • vacuum capable for external pump system (up to 10E-6 hPa, for up to 10E-3 hPa: see RTP-150),
    incl. turbo molecular pump, vacuum measurement, gate valve and pressure gauge; excl. rough pump
  • SPS process controller with 50 programs and up to 50 steps each (ethernet interface), SIMATIC
  • 7" touch panel for easy programming and process control
  • max. temperature 1000 °C
  • temperature control by thermocouple
  • water cooling required
  • electrical connection type: 32 A CEE plug (3 x 230 V, 3 Phase, N, PE, 21 kW)
  • dimension oven: 504 mm x 504 mm (700) x 690 mm (w x d x h)
  • weight: 78 kg

The oven will be programmed by a Siemens SPS controller. This allows the storage of 50 programs with saving all temperature profiles and segments.
Options and accessories like water cooler, additional flow meters, additional gas lines, additional thermocouple etc. are available on request. This tool
is for various applications and customers. The small size allows comfortable loading and unloading of the chamber. The oven can be easily placed on
a standard laboratory table.

 

Options and accessories:

RTP-150-HV Basic unit with 1 MFC for Nitrogen (5 nlm = norm liter per minute)
RTP-MFC Mass Flow Controller (max. 4 in total)
RTP-GP Graphite plate or suszeptor
RTP-PC-150 additional oven chamber for parallel usage with one process controller unit
(double pack oven) 150 mm;
no simultaneous operation of both chambers possible
RTP-QP Quartz plate
RTP-QC-150   spare quartz chamber for RTP-150
   
RTP-TC additional thermocouple to measure on device (plugged in chamber),  (max. 3)
WC III Closed loop water cooling system

 

RTP-200

RTP-200 / RTP-200-HV
Rapid Thermal Process Vacuum oven with or without high vacuum 

Technical Specification
• For one single wafer up to 200mm (8") diameter
• With integrated gas in- and outlet
• Maximum temperature: 1000 °C
• Ramp up rate: up to 75 K/sec
• Temperature control by thermocouple (K or S)
• No quartz chamber, aluminium chamber
• Dimensions: about 578 mm x 496 mm x 570 mm (W x D x H)
• Weight: about 70 kg


Part holder
• Quartz tray, fix integrated in door
• Quartz holder for single wafer with 200 mm diameter

Heating

• Heated by 2 x 12 infrared lamps (nominal voltage/power of IR heater: 230 V/2 kW)
• Top and bottom heating (selectable)

Vacuum
•  pressure scale 10exp-3 hPa ... 1000 hPa, or 10exp-6 hPa für RTP-200-HV 

Process Control
• SPS process controller with 50 programs and up to 50 steps each 
  (ethernet interface), SIMATIC
• 50 programs each with up to 50 steps can be stored on touch panel
• USB 2.0 interface for storage of process data (in CSV file format)
• Including 7" touch panel for intuitive and comfortable operation

Water cooling
• Water cooling required (inlet pressure: 5 bar, water inlet temperature: 16...20 °C, low water hardness (< 5° dH), 
   free of Cu particles)

VPO-300 (automatic vertical open/close)

Vacuum Process Oven for up to 300 x 300 mm substrate size and temperature up to 1000 °C

Lamp heated rapid thermal annealing RTA and rapid thermal processing RTP equipment are using lamp heating in order to ramp up and cool down semiconductor wafers pretty fast. This equipment is therefore mainly used for applications where the substrate needs to be brought to a certain temperature just only for short time. The high ramp rates allow a short overall process time and keep the thermal budget (this is the total time of a wafer, being exposed to high temperature) of the wafer low. Because of the design of the heaters, these RTA and RTP tools are used mainly for single wafer treatment. Wafers have to be treated one by one. This is not as important as for other batch thermal processes, which use vertical furnaces and horizontal furnaces, because the process time is very short anyway. However wafer handling takes a substantial part of process time.
The VPO-300 is a cold wall oven.


UniTemp RTP furnaces offer a unique lamp arrangement with upper and lower cross lamp arrays. The temperature distribution tool provides outstanding and unparalleled temperature uniformity resulting in process repeatability.

Application:

Perfect for wafer up to 300 mm or substrates  up to 300 x 300 mm.

Through the chamber walls there can be led different feed throughs, like a window for optical measurement tools, thermocouple feed through, gas inlets, etc.
The process cycles are very short due to fast reaching of vacuum with 10E -3 hPa.

Here are the most feasable applications:

Processes using also other contaminating processes possible and all other applications of a RTP/RTA oven are oblitgatory,like:

  • Annealing processes
  • Rapid Thermal Processes
  • SiAu, SiAl, SiMo alloying
  • low k dielectrics
  • post implanting annealing

Chamber:

  • Chamber size: 350 x 350 x 50 mm
  • Loading area: 300 x 300  mm
  • chamber height: 50 mm (optional: chamber height 100 mm with viewing window 85mmx25mm)
  • optional: extended opening height: 200 mm to 300 mm 
  • Chamber walls: Aluminium polished, easy to clean (optional: stainless steel)

Loading:

  • Cover opens and closes vertically
  • Direct or remote control  for automatically application on request (SPS, robotics,etc).

Heating:

  • Bottom heating:  Infrared lamps crossed 21 kW
  • Upper heating:   Infrared  lamps crossed 21 kW (selectable)

 Cooling:

  • Chamber: Gas N2

Process control:

  • Control: SIMATIC  SPS  with 7" touch panel
  • 50 programs with 50 steps each storable

Process gases:

  • 1 Mass Flow controller for 5 nlm (=norm liter per minute) is standard
  • Optional: up to add. 3 gas lines (Nitrogen, Argon, Helium, Oxygen, optionally
    Hydrogen)

Vacuum (optional):

  • MP (Membrane pump
  • RVP (Rotary vane pump):  10E -3 hPa. Vacuum sensor up to 10E -3 hPa
  • other pumps on request

Connections:

  • Power 2 x (400/230V, 21 kW)
  • Vacuum connector: KF 16/25
  • Exhaust: KF16 rear site
  • Gas lines: Swagelok 6 mm compression fitting
  • Cooling water supply: 10 mm/12mm
  • Compressed dry air (CDA), 6 mm OD, 5 - 6 bar

Dimension/weight:

  • Dimension: 540 x 690 x 890 mm (w x d x h)
  • Weight:   about 140 kg
     
VPO-MFC Mass Flow Controller (max. 3 pcs)
VPO-RVP Rotary vane pump for vacuum up to 10exp.-3 with oil filter
VPO-SS Chamber made of stainless steel instead of Alu (polished) 50 mm
VPO-H2 Hydrogen module
VPO-GP Graphite Plate 3 mm thick
VPO-QP Quartz plate for separation of the top lamp area
VPO-QH Quartz universal holder for 100 mm up to 300 mm wafer size (star)
VPO-TC additional thermocouple to measure on device (plugged in chamber); for external measurement tool max. 4 pcs
WC-III Closed loop water cooling system
Vacuum We offer different vacuum pumps and vacuum equipment
VPO-SI Serial interface between VPO sytem and external PC using USB 2.0 port and through USB 2.0 cable
VPO-RC Remote control of top cover and closing, including connection to safety of external cabinet

 

VPO-300-HV

Vacuum Process Oven for up to 300 x 300 mm substrate size and temperature up to 1000 °C)

Lamp heated rapid thermal annealing RTA and rapid thermal processing RTP equipment are using lamp heating in order to ramp up and cool down semiconductor wafers pretty fast. This equipment is therefore mainly used for applications where the substrate needs to be brought to a certain temperature just only for short time. The high ramp rates allow a short overall process time and keep the thermal budget (this is the total time of a wafer, being exposed to high temperature) of the wafer low. Because of the design of the heaters, these RTA and RTP tools are used mainly for single wafer treatment. Wafers have to be treated one by one. This is not as important as for other batch thermal processes, which use vertical furnaces and horizontal furnaces, because the process time is very short anyway. However wafer handling takes a substantial part of process time.

The VPO-300-HV is a cold wall oven.

UniTemp RTP furnaces offer a unique lamp arrangement with upper and lower cross lamp arrays. The temperature distribution tool provides outstanding and unparalleled temperature uniformity resulting in process repeatability.

Application: 

Perfect for wafer up to 300 mm or substrates  up to 300 x 300 mm.

Through the chamber walls there can be led different feed throughs, like a window for optical measurement tools, thermocouple feed through, gas inlets, etc.
The process cycles are very short due to fast reaching of vacuum with 10E -3 hPa.

Here are the most feasable applications:

Processes using also other contaminating processes possible and all other applications of a RTP/RTA oven are oblitgatory,like:

  • Annealing processes
  • Rapid Thermal Processes
  • SiAu, SiAl, SiMo alloying
  • low k dielectrics
  • post implanting annealing

Chamber:

  • Chamber size: 350 x 350 x 50 mm
  • Loading area: 300 x 300  mm
  • chamber height: 50 mm (optional: chamber height 100 mm with viewing window 85x25mm)
  • optional: extended opening height: 200 mm to 300 mm 
  • Chamber walls: Aluminium polished, easy to clean (optional: stainless steel)

Loading:

  • Cover opens and closes vertically
  • Direct or remote control  for automatically application on request (SPS, robotics,etc).

Heating:

  • Bottom heating:  Infrared lamps crossed 21 kW
  • Upper heating:   Infrared  lamps crossed 21 kW (selectable)

 Cooling:

  • Chamber: Gas N2

Process control:

  • Control: SIMATIC  SPS  with 7" touch panel
  • 50 programs with 50 steps each storable

Process gases:

  • 1 Mass Flow controller for 5 nlm (=norm liter per minute) is standard
  • Optional: up to add. 3 gas lines (Nitrogen, Argon, Helium, Oxygen, optionally
    Hydrogen)

Vacuum:

  • Turbomolecular pump, vacuum valve and measurement included
    for vacuum up to 10E-6 hPa. 
  • Optional as forepump:
  • MP (Membrane pump)
  • RVP (Rotary vane pump):  10E -3 hPa. Vacuum sensor up to 10E -3 hPa
  • other pumps on request

Connections:

  • Power 2 x (400/230V, 21 kW)
  • Vacuum connector: KF 16/25
  • Exhaust: KF16 rear site
  • Gas lines: Swagelok 6 mm compression fitting
  • Cooling water supply: 10 mm/12mm
  • Compressed dry air (CDA), 6 mm OD, 5 - 6 bar

Dimension/weight:

  • Dimension: 540 x 690 x 890 mm (w x d x h)
  • Weight:   about 145 kg
     
VPO-MFC Mass Flow Controller (max. 3 pcs)
VPO-RVP Rotary vane pump for vacuum up to 10exp.-3 with oil filter
VPO-SS Chamber made of stainless steel instead of Alu (polished) 50 mm
VPO-H2 Hydrogen module
VPO-GP Graphite Plate 3 mm thick
VPO-QP Quartz plate for separation of the top lamp area
VPO-QH Quartz universal holder for 100 mm up to 300 mm wafer size (star)
VPO-TC additional thermocouple to measure on device (plugged in chamber); for external measurement tool max. 4 pcs
WC-III Closed loop water cooling system
Vacuum We offer different vacuum pumps and vacuum equipment
VPO-SI Serial interface between VPO sytem and external PC using USB 2.0 port and through USB 2.0 cable
VPO-RC Remote control of top cover and closing, including connection to safety of external cabinet