Wirebonder

Wirebonder

WB200e - Ultrasonic & Reflow Die Bonder

  • The WB200e, a Die Bonder Equipment designed for accurate placement devices on substrate
  • Flip Chip Vision & Thermosonic bonding capabilities
  • Thermocompression & Eutectic capabilities
  • Reflow capability
  • Dispensing for glue or/and paste capability
  • High Magnification Optical Device for a high accuracy placement
  • Pick and Place of Dies under Vacuum with single collet
  • External Vibration Free

WB-300-U - Wire bonder with 3 automatic axis

Semiautomatic Wire Bonder (wedge and ball) with 3 motorized axis

Very compact table top unit, all 3 axes, mouse controlled

  • Wedge/ Ball Bonding with gold or aluminium wire
  • 17 μm - 50 μm
  • Motorized Deep Access Bondhead Z-axis 50 mm
  • Accuracy 1,0 μm
  • Bond arm length 165 mm
  • Motorizied X-Y-table
  • Fine table motion 50 x 50 mm
  • Accuracy 1,0 μm

General specification:

  • Very compact table top unit, mouse controlled x,y,z-axis (296 mm x 570 mm x 490 mm, w x d x h)
  • Wedge/Ball and secure Ball Bonding with gold or aluminium wire (17…50 µm)
  • Motorized Deep Access Bond head z axis (40 mm vert. travelling distance, 1 µm accuracy)
  • Motorized x-y table (250 mm diameter, 50 mm x 50 mm travelling distance, 1 µm accuracy)
  • Incl. hot chuck 60mm dia. With vacuum hold and clamp holder
  • Optional: microscope / binocular

Vertical camera

True vertical motion – no parallax error

Incl. DELL PC and 12” Siemens display

  • Crosshairs <2µm of vertical camera
  • Microscope binocular
  • Allows using microscope AND vertical camera simultaneously
  • 106 kHz transducer