Hot Plate
HP-155 - Compact hot plate with integrated precision controller
Compact hot plate with integrated precision controller Reflow of any soldering alloy Pre-heating for wire bonding Expoy curing Laboratory tests
Technical Data:
| Heated Area: | 155x155 mm |
| Temperature Range: | up to 350 °C |
| Power supply: |
230V, 1000 Watts |
| Dimension HP-155: | 320 mm x 210 mm x 55 mm |
| Weight> | 3,5kg |
HP-220 - Programmable hot plate with integrated high precision Eurotherm controllerand vacuum hold
Programmable hot plate with integrated high precision Eurotherm controllerand vacuum hold for 2 pc 100mm wafer/substrrate size
Applications examples:Reflow Soldering of flat componentsPreheating of heavy parts for solderingAnnealingCuring of photoresists and epoxies Laboratory tests
Optional: Cover with viewing window and connection to exhaust for solvents
| accepts 2 pieces 100mm wafers parallel | |
| heated area: | 220 mm x 155 mm |
| Part fixture: | 2 vacuum holes in the heated plate |
| Temperature Range: | up to 250 °C |
| Ramp-up rate: | max. 25 K/min |
| Ramp-down rate: | max. 10 K/min |
| Cool down: | controlled cool down |
| Programming: | programmable with up to 16 segments (heating and cooling) |
| Interface to PC: | USB interface and PC-Windows Software (as option) for programming, program administration and monitoring |
| Cover: | with cover protection for connection to exhaust (solvent vapors) (height under cover: 80mm) |
| Leveling feet: | adjustable |
HP-300 - Heated chuck for 300 mm x 300 mm substrates or 300 mm Diameter
This high precision hot chuck has a heated area with 310 x 310 mm.
It can be used as build-in or stand-alone chuck with an external controller.
The vacuum hot plate has vacuum holes in a pitch of 25mm each (1mm Diameter)
for holding the substrate or wafer.
The maximum temperature is 300 °C.
3-Zone-temperature measurement
incl. Software for managing the temperature profiles
IP code 23
Die Vakuumplatte hat Rasterbohrungen im 25mm Abstand (1mm Bohrungen)
Die maximale Temperatur beträgt 300 °C.
3-Zonen-Temperaturmessung
inkl. Software zur Verwaltung von Temperaturprofilen
Gehäuseart: IP23
HP-60 - Reflow Soldering of flat components
Applications examples:
- Reflow Soldering of flat components
- Preheating of heavy parts for soldering,
- annealing.
- curing of photoresists and epoxies
Technical Data:
| Heated Area: | 60 mm diameter |
| Temperature Range: | up to 250 °C |
| Power supply: | 40V, 80Watts |
| Dimension: | dia. 80mm total |
| Height adjustable: | 66-78mm |
| Weight | 0,6kg |
| External Temperature Controller: | HC-40 |
HP-155 - Programmable Hot Plate with vacuum hold
Programmable Hot Plate with vacuum hold for 3" up to 6" wafer size wafer size or 150x150mm substrate size
- Applications examples:
- Reflow Soldering of flat components
- Preheating of heavy parts for soldering
- Annealing
- Curing of photoresists and epoxies
Options:
USB interface including UniSoft Software
Technical Data:
| Heated Area: | 155x155 mm |
| Controller: | Eurotherm 2416 model |
| Temperature Range: | up to 350 °C |
| Power supply: | 230V, 1000 Watts or 115V, 1000Watts |
| Dimension HPP-155: | 320x210x85mm |
| Weight | 4 kg |
HPP-155-L - Programmable Hot Plate with lift pins
Programmable Hot Plate with lift pins with vacuum hold for 3" up to 6" wafer size wafer size or 150 x 150 mm substrate size
- Applications examples:
- Reflow Soldering of flat components
- Preheating of heavy parts for soldering
- Annealing
- Curing of photoresists and epoxies
Technical Data:
| Heated area: | 155 x 155 mm |
| Lift pins: | 3 lift pins programmable |
| Temperature range: | Room temperature up to 350 °C |
| Part fixture: | by vacuum for external vacuum pump |
| Programming: | USB (optional) with Eurotherm 2416 controller |
| Power supply: | 230 V, 1000 W or 115 V, 1000 W |
| Weight: | 4 kg |
Plasma Cleaning & Heat: PTP-300 - Universal temperature and plasma cleaning machine with maximum part loading area
Universal temperature and plasma cleaning machine with maximum part loading area: 305 mm x 305 mm (25 mm max. part height)
Applications:
- Activation, cleaning and coating of surfaces
- fast ramp up heating of substrates and wafers
- fluxless soldering
- flip chip processing
- adhesive bonding
- Solder bump reflow
- Soldering of power devices
- small series production and prototype development
Technical Data PTP-300 :
| Loading area: | 305 mm x 305 mm x 25 mm (process area) |
| Chamber height: | 35 mm |
| Chamber material: | Aluminium / quartz glass |
| Chamber material (optional): | Aluminium or quartz glass process chamber (size: 305 x 305 x 26 mm) |
| Dimension outside: | 600 mm x 1850 x 880 mm (WxDxH) |
| Chamber: | integrated gas inlet / 2 gas lines are default |
| Gas lines: | 2 Mass Flow Controllers |
| Vacuum: | DN25 KF vacuum flange |
| Heating: | 24 infrared lamps (total 18 kW) |
| Process control by: | SPS Controller PP420 (B&R) with LCD display |
| Maintenance: | Ethernet |
| Microwave generator: | for plasma cleaning or removal of oxyde resists 2,45 GHz, max. 600 W, stepless from 100 W to 600 W |
| Cooling: | water cooling required (water cooler optional) |
| Power: | 3/N/PE; AC; 50/60 Hz; 230/400 V |
| Weight: | 150-200 kg (depends on acessories) |
Options and accessories:
| PTP-AL | Automatic Loading |
| PTP-MFC | Mass Flow Controller |
| PTP-RPP | Double stage rotary vane pump for vacuum up to 10-3 mbar |
| PTP-HVP | Turbomolecular pump with gate valve and Pirani gauge for vacuum up to 10-6 mbar |
| PTP-WC | Closed loop water cooling system |
